You will own the mechanical design from package attach to rack rail — socket and retention for a multi-die accelerator, the sled and chassis it lives in, and the structures that hold everything within tolerance under load, shock and thermal cycling. Senior IC role: you define the mechanical architecture, not detail someone else's.

What you will work on:

• Socket, lid, stiffener and retention design for a high-power multi-die package

• Sled, chassis and rack-level mechanical architecture for an OCP-style platform

• Cold plate mounting, load distribution and interface pressure control

• Tolerance stack-up across die, package, board, socket and enclosure

• Shock, vibration and structural validation through to production

Responsibilities:

• Package & socket mechanics: Define bolster plate, stiffener and retention schemes that hold bond line and interface pressure across warpage and thermal cycling. Model package and board deflection, and set the load budget the thermal solution designs against.

• System mechanical design: Own sled, chassis, bracket and rail design for serviceability, airflow and cable routing. Drive DFM and DFA with ODM and contract manufacturing partners.

• Analysis: Run FEA for structural, thermal-mechanical, shock and random vibration cases. Own tolerance stack-up analysis and the GD&T that follows from it.

• Cross-functional: Partner with thermal on cold plate interface and flow paths, with PCB and SI/PI on keep-outs and stiffening, and with mechanical and tooling vendors on parts and fixtures. Support build events, bring-up and field returns.

Requirements:

• 8+ years in mechanical design for server, datacentre, networking or comparable high-power electronics

• Proven package-level mechanical work: sockets, retention hardware, stiffeners, warpage and interface pressure

• Strong 3D CAD (Creo, NX, SolidWorks) and GD&T, with real tolerance stack-up ownership

• FEA experience across structural, thermal-mechanical and dynamic load cases

• Experience driving parts through ODM, CM or tooling vendors into volume production

• Comfortable reasoning about the interaction between mechanical load, thermal interface and electrical reliability

Nice to Have:

• 2.5D, interposer or advanced substrate package mechanics

• Liquid-cooled cold plate and manifold mechanical design

• OCP rack and sled standards, ORv3, or comparable hyperscale form factors

• Shock and vibration test design, and correlation of models to test data

• Python or scripting for CAD automation and analysis post-processing

Why Semidynamics?

• Work for one of Europe’s most promising deep-tech semiconductor scale-ups.

• Accelerated development path.

• 4 days per week in the Barcelona office (city center), 1 day WFH.

• 1 week of work from everywhere in the world.

• Competitive package.

• A collaborative, technical, and growth-oriented environment that values direct ownership and clear thinking.